As electronic equipment continues to develop towards miniaturization and high performance, the miniaturization design and power density improvement of one-piece inductors have become key research directions, which are of extremely important significance for optimizing circuit layout and improving the overall performance of the equipment.
First of all, innovating in the selection of magnetic core materials is an important way to miniaturize and increase power density. New magnetic core materials with high magnetic permeability and high saturation magnetic flux density can carry greater current while reducing the core volume, thereby increasing power density. For example, some nanocrystalline core materials have higher magnetic permeability than traditional ferrite cores and can significantly reduce core size under the same inductance requirements. Moreover, its saturation magnetic flux density is higher, allowing greater current to pass without being easily saturated. This allows the One-piece inductor to handle higher power in a limited space, effectively increasing the power density.
Secondly, optimizing the winding process is crucial for miniaturization design. Using fine wire diameter and multi-strand winding can reduce DC resistance, reduce copper loss, and improve current carrying capacity without increasing the winding volume. For example, if the traditional single-strand thick wire winding is changed to multi-strand thin wires wound in parallel, the total cross-sectional area of the multi-strand thin wire is equivalent to that of the single thick wire. However, due to the influence of the skin effect, the multi-strand thin wire will The resistive loss is smaller. At the same time, through precision winding technology, such as three-dimensional winding, the space of the magnetic core can be fully utilized to make the winding more compact, further reducing the overall volume of the inductor, and creating favorable conditions for miniaturization and improvement of power density.
Furthermore, improving the structural design of the inductor can also achieve both miniaturization and power density. For example, an integrated structural design is adopted to integrate multiple inductor functional modules into one package, which reduces the connection lines and space occupation between modules and increases the power density. In addition, optimizing the shape of the magnetic core, such as using flattened, ring-shaped and other special-shaped magnetic cores, can better match the layout with other components on the circuit board and achieve higher power processing on a limited circuit board area. ability. At the same time, a reasonable design of the air gap structure of the magnetic core can accurately control the inductance, so that it can maintain a small size and high power density while meeting the circuit requirements.
Finally, in the process of miniaturization design, the heat dissipation issue cannot be ignored. Due to the reduced size, the heat dissipation of the One-piece inductor becomes more difficult. The use of packaging materials and heat sinks with high thermal conductivity can effectively dissipate the heat generated when the inductor is working, ensuring that the inductor operates stably under high power density. For example, adding metal heat sinks to the inductor package or using thermally conductive silicone to conduct heat to the heat dissipation layer of the circuit board can prevent the degradation of inductor performance due to excessive temperature through good thermal management, thereby ensuring One- The piece inductor can reliably operate normally with increased power density and meet the stringent requirements of modern electronic equipment for high performance and miniaturization.